Blue Cheetah Analog Design Announces Successful Tape-Out of BlueLynx™ Die-to-Die PHY on Samsung Foundry’s SF4X 4nm Process
Blue Cheetah Analog Design has successfully completed the tape-out of its next-generation BlueLynx™ die-to-die (D2D) PHY on Samsung Foundry’s cutting-edge SF4X 4nm advanced manufacturing process. This new PHY solution, which supports both advanced and standard chiplet packaging, delivers an impressive aggregate throughput of over 100 Tbps while maintaining industry-leading power efficiency and small silicon area footprint. The BlueLynx D2D subsystem IP empowers chip architects to meet the critical demands of bandwidth density and environmental robustness, ensuring a smooth transition from development to production while providing flexibility across various use cases.
Leveraging Samsung Foundry’s SF4X 4nm process, BlueLynx PHY supports both standard 2D and advanced 2.5D chiplet packaging technologies. This adaptability allows system designers to seamlessly transition between packaging solutions in both current and future designs. Customer deliveries for the new BlueLynx PHY began in 2024, with silicon characterization for both advanced and standard packaging expected to be completed by early Q2 2025.
Blue Cheetah’s versatile IP solutions are tailored for a wide range of applications, including AI/ML, high-performance computing, networking, and mobile devices, all built on advanced process nodes. The BlueLynx PHY supports leading industry interfaces such as Universal Chiplet Interconnect Express (UCIe) and the Open Compute Project (OCP) Bunch of Wires (BoW) interfaces. An optional link layer also connects to on-die buses and Networks-on-Chip (NoCs) via standards like AXI4, AXI5 Lite, ACE, and CHI.
Ben Hyo Gyuem Rhew, Vice President and Head of the IP Development Team at Samsung Electronics, highlighted, “Samsung Electronics offers a robust portfolio of advanced foundry process technologies that are optimized for generative AI and high-performance computing (HPC) chips. Blue Cheetah’s BlueLynx PHY technology helps our customers unlock the full potential of chiplet-based designs, accelerating time to market with proven, silicon-tested IP solutions.”
Elad Alon, CEO and Co-Founder of Blue Cheetah, added, “Die-to-die interconnect technology is a vital component of any chiplet-based design. We’re thrilled to provide our customizable, state-of-the-art chiplet interconnect solutions built on Samsung’s leading-edge logic process nodes, further enabling high-performance and flexibility for modern semiconductor designs.”
With these groundbreaking advancements, Blue Cheetah continues to push the boundaries of chiplet interconnect technologies, empowering designers to achieve unparalleled performance and efficiency in the rapidly-evolving semiconductor landscape.
